芯片冷却用微通道散热结构热流耦合场数值研究

中国机械工程 ›› 2011, Vol. 22 ›› Issue (23): 2863-2866.

芯片冷却用微通道散热结构热流耦合场数值研究

徐尚龙;秦杰;胡广新

电子科技大学，成都，610054

出版日期:2011-12-10 发布日期:2011-12-20
基金资助:
国家自然科学基金资助项目(50906009)；教育部博士点新教师基金资助项目(200806141062)
National Natural Science Foundation of China（No. 50906009）

Numerical Study on Heat-flow Coupling Field in Microchannel Heat Sink Structures for Electronic Chip Cooling

Xu Shanglong;Qin Jie;Hu Guangxin

University of Electronic Science and Technology of China, Chengdu, 610054

Online:2011-12-10 Published:2011-12-20
Supported by:
National Natural Science Foundation of China（No. 50906009）

摘要/Abstract

摘要：

对4种微通道散热结构(平行结构、网格结构、螺旋结构和树型结构)在相等传热面积、相同边界条件下的流场与温度场进行数值研究。通过热流耦合场数值分析，得出了不同微通道散热结构的电子芯片温度分布和微通道内的速度场，分析了微通道拓扑结构对电子芯片散热效果的影响。使用平行微通道散热的芯片温度均低于80℃，其中有81%的面积在60℃以下;使用网格和螺旋散热结构的芯片最高温度均在90℃以上，其中温度在20~60℃之间所占比例分别约为62%和61%;使用树型微通道散热的电子芯片温度均低于70℃，其中有94%的面积在60℃以下，且温度分布最均匀。此外，芯片微通道内的流体平均流速大的微通道系统能带走更多的热量。



关键词:

微通道, 芯片, 散热, 热流耦合

Abstract:

This paper studied on four styles of microchannel structures: parallel structure, gridding structure, helix structure, and tree-shaped structure's flow and heat transfer under the same conditions of equal transfer areas and same loads. The microchannel topological structures' influence on electronic chips cooling were analysed in the following of getting the electronic chips' temperature distribution and liquid's velocity field of the different microchannel heat sink structures. The temperature of the electronic chip with parallel microchannel to dispel heat is below 80℃ and almost 81% area of the chip is below 60℃. The temperature of the chips with gridding and helix microchannels are above 90℃,they separately have 62% and 61% of the chips'area is between 20℃ and 60℃.But the temperature of the electronic chip with tree-shaped microchannel to dispel heat is below 70℃ and more than 94% area of the chip is below 60℃ and the temperature distribution is of uniform. Besides, microchannel system can take over more quantity of heat while liquid's average velocity of flow inside the electronics' microchannel is big. This conclusion provides an important foundation of theory and technology in electronic chips’ heat elimination which have high heat flux density.

Key words: microchannel, , chip, , heat elimination, , heat-flow coupling

中图分类号:

TB131

徐尚龙, 秦杰, 胡广新.

芯片冷却用微通道散热结构热流耦合场数值研究

[J]. 中国机械工程, 2011, 22(23): 2863-2866.

XU Chang-Long, QIN Jie, HU An-Xin.

Numerical Study on Heat-flow Coupling Field in Microchannel Heat Sink Structures for Electronic Chip Cooling

[J]. China Mechanical Engineering, 2011, 22(23): 2863-2866.

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链接本文: https://www.cmemo.org.cn/CN/

https://www.cmemo.org.cn/CN/Y2011/V22/I23/2863

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