中国机械工程 ›› 2026, Vol. 37 ›› Issue (9): 2205-2215.DOI: 10.3969/j.issn.1004-132X.2026.09.013
• 机械基础工程 • 上一篇
收稿日期:2025-08-14
出版日期:2026-09-25
发布日期:2026-10-21
通讯作者:
鲁军勇
作者简介:严康为,男,1996年生,助理研究员。研究方向为机电结构健康监测、诊断与维护技术。E-mail:sqlasource@nue.edu.cn基金资助:
YAN Kangwei(
), LU Junyong(
), ZENG Delin, CHENG Long, TAN Sai
Received:2025-08-14
Online:2026-09-25
Published:2026-10-21
Contact:
LU Junyong
摘要:
针对高速移动载荷作用下的轨道动态响应问题,提出一种考虑轨道垂-轴向耦合变形与装配界面摩擦滑移的弹性梁动态响应分析框架,综合电磁斥力、电枢扩张力、预紧力、后坐力、摩擦力等输入载荷的时空分布特性,建立了包含轨道垂-轴向耦合振动、封装壳/绝缘体轴向振动以及封装壳-轨道-绝缘体装配界面动态滑移特性的完整结构动力学模型。通过与光纤光栅传感器实测应变数据对比,检验了所提模型的准确性。研究表明,电枢通过后直至出口前,在电磁后坐力和枢轨摩擦力的共同作用下,轨道中前段区域存在显著的轴向变形,可能引发低周疲劳和蠕变等劣化损伤。此外,在电枢前方轨道观察到高速前驱波特征,推断其源于电磁后坐力所致轴向应力波的前向传播。研究结果弥补了当前轨道动态响应研究缺乏垂-轴向耦合变形分析的缺陷,为封装壳-轨道-绝缘体装配结构的延寿优化与可靠性评估提供了理论依据。
中图分类号:
严康为, 鲁军勇, 曾德林, 程龙, 谭赛. 高速移动载荷作用下的垂-轴向耦合弹性梁动态响应分析[J]. 中国机械工程, 2026, 37(9): 2205-2215.
YAN Kangwei, LU Junyong, ZENG Delin, CHENG Long, TAN Sai. Dynamic Response of Axial-Vertical Coupled Elastic Beams under High-speed Moving Loads[J]. China Mechanical Engineering, 2026, 37(9): 2205-2215.
| 参数 | 数值 | 参数 | 数值 | 参数 | 数值 |
|---|---|---|---|---|---|
| 轨道长度L/m | 2.8 | 轨道截面惯性矩I/m4 | 1.31×10-7 | Stribeck特征速度/(m · s-1) | 800 |
| 轨道弹性模量E/Pa | 128×109 | 轨道间距s/m | 0.05 | 封装壳与轨道摩擦因数μrc | 0.03 |
| 封装壳弹性模量Ec/Pa | 206×109 | 轨道厚度h/m | 0.032 | 绝缘体与轨道摩擦因数μrs | 0.1 |
| 绝缘体弹性模量Es/Pa | 25×109 | 枢轨接触长度la/m | 0.055 | 反后坐弹性系数kspr/(N · m-1) | 1.2×106 |
| 轨道密度ρ/(kg · m | 8450 | 馈电区域长度lb/m | 0.2 | 发射器预紧载荷ppr/Pa | 0.5×106 |
| 封装壳密度ρc/(kg · m | 7545 | 封装壳侧地基系数kc/Pa | 72×109 | 发射器电感梯度L | 0.48×10-6 |
| 绝缘体密度ρs/(kg · m | 1850 | 绝缘体侧地基系数ks/Pa | 8.6×109 | 时间步长Δt/s | 1×10-6 |
| 轨道截面积A/m2 | 1.38×10-3 | 阻尼系数cf/(kg · m-1 · s-1) | 0.2×106 | 空间步长Δx/m | 1×10-3 |
| 封装壳截面积Ac/m2 | 6.56×10-3 | 枢轨静摩擦因数μra,s | 0.25 | 隐式迭代允许容差δ/m | 1×10-6 |
| 绝缘体截面积As/m2 | 0.45×10-3 | 枢轨库仑摩擦因数μra,c | 0.08 | 隐式迭代最大次数Nmax | 20 |
表1 模型参数
Tab.1 Model parameters
| 参数 | 数值 | 参数 | 数值 | 参数 | 数值 |
|---|---|---|---|---|---|
| 轨道长度L/m | 2.8 | 轨道截面惯性矩I/m4 | 1.31×10-7 | Stribeck特征速度/(m · s-1) | 800 |
| 轨道弹性模量E/Pa | 128×109 | 轨道间距s/m | 0.05 | 封装壳与轨道摩擦因数μrc | 0.03 |
| 封装壳弹性模量Ec/Pa | 206×109 | 轨道厚度h/m | 0.032 | 绝缘体与轨道摩擦因数μrs | 0.1 |
| 绝缘体弹性模量Es/Pa | 25×109 | 枢轨接触长度la/m | 0.055 | 反后坐弹性系数kspr/(N · m-1) | 1.2×106 |
| 轨道密度ρ/(kg · m | 8450 | 馈电区域长度lb/m | 0.2 | 发射器预紧载荷ppr/Pa | 0.5×106 |
| 封装壳密度ρc/(kg · m | 7545 | 封装壳侧地基系数kc/Pa | 72×109 | 发射器电感梯度L | 0.48×10-6 |
| 绝缘体密度ρs/(kg · m | 1850 | 绝缘体侧地基系数ks/Pa | 8.6×109 | 时间步长Δt/s | 1×10-6 |
| 轨道截面积A/m2 | 1.38×10-3 | 阻尼系数cf/(kg · m-1 · s-1) | 0.2×106 | 空间步长Δx/m | 1×10-3 |
| 封装壳截面积Ac/m2 | 6.56×10-3 | 枢轨静摩擦因数μra,s | 0.25 | 隐式迭代允许容差δ/m | 1×10-6 |
| 绝缘体截面积As/m2 | 0.45×10-3 | 枢轨库仑摩擦因数μra,c | 0.08 | 隐式迭代最大次数Nmax | 20 |
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