J4 ›› 2008, Vol. 19 ›› Issue (11): 0-1269.

• 学科发展 •    

芯片键合换能系统研究现状分析

吴运新;隆志力;韩雷;钟掘   

  • 收稿日期:1900-01-01 修回日期:1900-01-01 出版日期:2008-06-10 发布日期:2008-06-10

State-of-the-art of Ultrasonic Transducer Research in Microelectronics Packaging

Wu Yunxin;Long Zhili;Han Lei;Zhong Jue   

  • Received:1900-01-01 Revised:1900-01-01 Online:2008-06-10 Published:2008-06-10

摘要:

换能系统是芯片封装装备的核心机构,其工作性能直接决定键合质量。结合自身研究成果,综述了芯片键合换能系统的研究现状,分析了当前换能系统的理论建模与设计方法,包括解析法、传递矩阵法、等效电路法以及有限元法等。结合多年的试验测试,分析了当前换能系统存在的缺陷与不足,如频率混叠、超声能量不稳定、响应滞后等,指出了满足未来系统级封装工艺要求的换能系统的发展方向,提出了提高换能系统工作性能的若干建议。

关键词: 换能系统; 超声键合; 研究现状; 发展趋势

Abstract:

Ultrasonic transducer is the key component in the microelectronics packaging machine, and its working performance directly influences the bonding quality. The present research on ultrasonic transducer system was summarized by our recent researches herein. The theory modeling and design process were discussed, which included numerical analysis, transfer matrix, equivalent circuit method and finite element analysis.By our experimental measurements, the shortcomings for current bonding transducer were summarized. The development trend of the transducer system, which met for the SIP (system in packaging) in the future,was pointed out. Some useful suggestions for improving the working performance of the transducer were brought forward, which are of great significance to develop the bonding transducer in China.

Key words: ultrasonic transducer, ultrasonic bonding, research present, research trend

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