基于螺旋理论的转动解耦调平机构型综合

中国机械工程 ›› 2012, Vol. 23 ›› Issue (18): 2213-2217,2242.

基于螺旋理论的转动解耦调平机构型综合

蔡伟林;熊涛;尹周平

华中科技大学数字制造装备与技术国家重点实验室,武汉,430074

出版日期:2012-09-25 发布日期:2012-09-29
基金资助:
国家重点基础研究发展计划（973计划）资助项目（2009CB724204);国家自然科学基金资助重点项目（50835004)
National Program on Key Basic Research Project (973 Program)（No. 2009CB724204）;

Key Program of National Natural Science Foundation of China（No. 50835004）

Type Synthesis of a Rotational Decoupled Leveling Mechanism Based on Screw Theory

Cai Weilin;Xiong Tao;Yin Zhouping

State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University of Science and Technology,Wuhan,430074

Online:2012-09-25 Published:2012-09-29
Supported by:

National Program on Key Basic Research Project (973 Program)（No. 2009CB724204）;

Key Program of National Natural Science Foundation of China（No. 50835004）

摘要/Abstract

摘要：

芯片与基板之间的平行度调节机构对倒装键合设备的成品率起着决定性作用。为研制该调平机构，基于螺旋理论分析了二自由度转动解耦机构的实现条件,综合出了一类含有3支链的转动解耦的并联机构。该类机构的支链1不含驱动副,由2个转动副组成;支链2和支链3各有1个驱动副，分别驱动动平台绕支链1中的一根转动副轴线旋转。针对其中一种只含转动副和移动副的构型进行了自由度验算，选择了合适的输入运动副，并利用ADAMS完成了该机构的运动学仿真。研究结果表明,该转动解耦的调平机构可应用于倒装键合设备、精密运动平台等多种场合。
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关键词: 型综合, 螺旋理论, 调平机构, 转动解耦

Abstract:

A leveling mechanism for adjusting the parallelism between the chip and substrate is a key part of flip chip bonder and it takes significant effect on the yield of product developed by flip chip technology.The basic condition to develop a two-degree-of-freedom rotational decoupled mechanism was proposed based on screw theory,and type synthesis of this kind of parallel mechanism was accomplished.Each of these mechanisms had three legs,the first of which was only made up of two passive revolute joints and the other two of which each owned an active joint to drive platform to rotate about one of the axes of revolute joints in the first leg respectively.Furthermore,mobility analysis,the selection of inputs and kinematics
simulation using ADAMS were dealt with in sequence for one type of mechanism which was only constructed by revolute and prismatic joints.Results show that this mechanism is applicable to flip chip bonder,
precision worktable and other circumstance.

Key words: type synthesis, screw theory, leveling mechanism, rotational decoupling

中图分类号:

TH112

蔡伟林, 熊涛, 尹周平. 基于螺旋理论的转动解耦调平机构型综合[J]. 中国机械工程, 2012, 23(18): 2213-2217,2242.

CA Wei-Lin, XIONG Chao, YIN Zhou-Beng. Type Synthesis of a Rotational Decoupled Leveling Mechanism Based on Screw Theory[J]. China Mechanical Engineering, 2012, 23(18): 2213-2217,2242.

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