微电子封装点胶技术的研究进展

中国机械工程 ›› 2011, Vol. 22 ›› Issue (20): 2513-2519.

• 学科发展 • 上一篇

微电子封装点胶技术的研究进展

孙道恒;高俊川;杜江;江毅文;陶;巍;王凌云

厦门大学,厦门,361005

出版日期:2011-10-25 发布日期:2011-11-02
基金资助:
中央高校基本科研业务费专项资金资助项目(2010121039)；国家自然科学基金资助项目(51035002，50875222)
Fundamental Research Funds for the Central Universities( No. 2010121039 );
National Natural Science Foundation of China（No. 51035002，50875222）

Advances in Fluid Dispensing Technology for Micro-electronics Packaging

Sun Daoheng;Gao Junchuan;Du Jiang;Jiang Yiwen;Tao

Wei;Wang Lingyun

Xiamen University,Xiamen,Fujian,361005

Online:2011-10-25 Published:2011-11-02
Supported by:

Fundamental Research Funds for the Central Universities( No. 2010121039 );
National Natural Science Foundation of China（No. 51035002，50875222）

摘要/Abstract

摘要：

流体点胶是一种以受控的方式对流体进行精确分配的过程,它是微电子封装行业的关键技术之一。目前，点胶技术逐渐由接触式点胶向无接触式(喷射)点胶技术转变。从微电子封装过程的应用出发，对点胶技术的发展进行了概述;在对比各种点胶方式的同时，重点介绍了无接触式喷射点胶技术，以及其中所涉及的关键技术，并提出了评价点胶品质的标准。

关键词:

微电子封装, 流体点胶, 针头点胶, 无接触式, 喷射

Abstract:

Fluid dispensing is a process to dispensing the fluid accurately in a controlled manner,it is one of the key technologies of microelectronics packaging.At present, there is an evolution in the fluid dispensing technology for applying fluids from contact methods to non-contact methods, such evolution will bring a great change for the dispensing industry.Based on the applications of dispensing technology in microelectronics packaging processes,dispensing technical development process was overviewed.Contrasting the features and performances of various methods,the non-contact jetting technology was mainly highlighted,including its key technologies and the evaluation standard of dispensing quality.

Key words:

micro-electronics packaging, fluid dispensing, needle dispensing, non-contact, jetting

中图分类号:

TN4
TH137

孙道恒, 高俊川, 杜江, 江毅文, 陶, 巍, 王凌云.

微电子封装点胶技术的研究进展

[J]. 中国机械工程, 2011, 22(20): 2513-2519.

SUN Dao-Heng, GAO Dun-Chuan, DU Jiang, JIANG Yi-Wen, DAO,WEI,WANG Ling-Yun.

Advances in Fluid Dispensing Technology for Micro-electronics Packaging

[J]. China Mechanical Engineering, 2011, 22(20): 2513-2519.

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微电子封装点胶技术的研究进展

Advances in Fluid Dispensing Technology for Micro-electronics Packaging

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