Periodicals with Social and Economic Benefits
Core Journals of China
China’s Core Scientific Journals
RCCSE Periodical
Chinese Applied Core Journals (CACJ)
Periodicals in WJCI Report
LI Biao, LI Jun, GAO Beng, SHU Yong-Wei, LUO Hai-Jun, ZUO Dui-Wen. Study on Depth of Subsurface Crack Layer by Free and Fixed Abrasive Lapping[J]. China Mechanical Engineering, 2013, 24(07): 895-898,905.
[1]Suratwala T,Steele R,Feit M D,et al. Effect of Rogue Particles on the Sub-surface Damage of Fused Silica during Grinding/Polishing[J]. Journal of Non-crystalline Solids,2008,354(18):2023-2037.
[2]张银霞. 单晶硅片超精密加工表面亚表面损伤检测技术[J]. 电子质量,2004(7):73-75.
Zhang Yinxia.Measurement of Silicon Wafer Surface/Subsurface Damage Induced by Ultra-precision Processing[J]. Electronics Quality,2004(7):73-75.
[3]李圣怡,王卓,吴宇列,等. 基于研磨加工参数的亚表面损伤预测理论和试验研究[J]. 机械工程学报,2009,45(2):192-198.
Li Shengyi,Wang Zhuo,Wu Yulie,et al. Prediction Theory and Experiment of Subsurface Damage Based on Lapping Processing Parameters[J]. Journal of Mechanical Engineering,2009,45(2):192-198.
[4]王卓,吴宇列,戴一帆,等. 光学材料研磨亚表面损伤的快速检测及其影响规律[J]. 光学精密工程,2006,16(1):16-21.
Wang Zhuo,Wu Yulie,Dai Yifan,et al. Rapid Detection of Subsurface Damage of Optical Materials in Lapping Process and Its Influence Regularity[J]. Optics and Precision Engineering,2006,16(1):16-21.
[5]李改灵,吴宇列,王卓,等. 光学材料亚表面损伤深度破坏性测量技术的实验研究[J]. 航空精密制造技术,2006,42(6):19-22.
Li Gailing,Wu Yulie,Wang Zhuo,et al. Experiment Study on the Destructive Measurement of the Depth of SSD for Optical Material[J]. Aviation Precision Manufacturing Technology,2006,42(6):19-22.
[6]吴东江,曹先锁,王强国,等. KDP晶体加工表面的亚表面损伤检测与分析[J]. 光学精密工程,2007,15(11):1721-1726.
Wu Dongjiang,Cao Xiansuo,Wang Qiangguo,et al. Damage Detection and Analysis of Machined KDP Crystal Subsurface[J].Optics and Precision Engineering,2007,15(11):1721-1726.
[7]王强国,高航,裴志坚,等. KDP晶体超声辅助磨削的亚表面损伤研究[J]. 人工晶体学报,2010,39(1):67-71.
Wang Qiangguo,Gao Hang,Pei Zhijian,et al. Study on the Subsurface Damage of KDP Crystal Ground with Ultrasonic Vibration Assistance[J]. Journal of Synthetic Crystals,2010,39(1):67-71.
[8]马彬,沈正祥,张众,等. 低亚表面损伤石英光学基底的加工和检测技术[J]. 强激光与粒子束,2010,22(9):2181-2185.
Ma Bin,Shen Zhengxiang,Zhang Zhong,et al. Fabrication and Detection Technique of Fused Silica Substrate with Extremely Low Subsurface Damage[J]. High Power Laser and Particle Beams,2010,39(1):67-71.
[9]Suratwala T,Wong L,Miller P,et al. Sub-surface Mechanical Damage Distributions during Grinding of Fused Silica[J]. Journal of Non-crystalline Solids,2006,352(52/54):5601-5617.
[10]Gao P,Li J,Zhu Y W,et al. Study on Subsurface Damage after Fixed-abrasive Lapping with Different Particle Size[J]. Solid State Phenomena,2011,175:112-115.
[11]Li J,Gao P,Zhu Y W,et al. Research on Subsurface Damage after Abrasives and Fixed-abrasive Lapping of K9 Glass[J]. Key Engineering Materials,2011,487: 253-256.
[12]Li J,Zhu Y W,Zuo D W,et al. Fixed Abrasive Lapping and Polishing of Hard Brittle Materials[J]. Key Engineering Materials,2010,426/427:589-592.
[13]朱永伟,王军,李军. 固结磨料抛光垫抛光硅片的探索研究[J]. 中国机械工程,2009,20(6):723-727.
Zhu Yongwei,Wang Jun,Li Jun. Exploratory Study of Lapping Silicon Wafer with Fixed Abrasive Pad[J]. China Mechanical Engineering,2009,20(6):723-727.
[14]林奎,朱永伟,李军,等. 固结磨料抛光K9光学玻璃的工艺实验研究[J]. 激光与光电子学进展,2010,47(4):041603.
Lin Kui,Zhu Yongwei,Li Jun,et al. Experimental Study on Polishing Technology of K9 Optical Glass with Fixed Abrasive Pad[J]. Laser and Optoelectronics Progress,2010,47(4):041603.