中国机械工程 ›› 2021, Vol. 32 ›› Issue (19): 2331-2339.DOI: 10.3969/j.issn.1004-132X.2021.19.008

• 机械基础工程 • 上一篇    下一篇

单颗磨粒超声辅助磨削SiC陶瓷材料去除机理

丁凯;李奇林;雷卫宁;徐铭洲;王许   

  1. 江苏理工学院机械工程学院,常州,213001
  • 出版日期:2021-10-10 发布日期:2021-11-05
  • 作者简介:丁凯,男,1983年生,博士、副教授。研究方向为硬脆材料超声辅助加工技术。E-mail:dingkai@jsut.edu.cn。
  • 基金资助:
    国家自然科学基金(51805231,51905234)

Material Removal Mechanism during UAG of SiC Ceramic with a Brazed Single Abrasive Grain Tool

DING Kai;LI Qilin;LEI Weining;XU Mingzhou;WANG Xu   

  1. School of Mechanical Engineering,Jiangsu University of Technology,Changzhou,Jiangsu,213001
  • Online:2021-10-10 Published:2021-11-05

摘要: 为研究不同磨削速度下超声振动作用对SiC陶瓷磨削过程中材料去除机理的影响,采用钎焊单颗金刚石磨粒工具,基于连续变磨削深度试验方法,在SiC陶瓷抛光表面开展了超声辅助磨削与普通磨削对比试验。结果表明,随着单颗磨粒磨削深度的逐渐增大,SiC陶瓷超声辅助磨削与普通磨削时的材料去除机理均经历了“塑性去除→脆-塑转变→大尺寸脆性断裂”的变化;在磨削速度为1 m/s时,相比于普通磨削,单颗磨粒超声辅助磨削可显著增大SiC陶瓷的脆-塑转变临界切厚及相应的磨削划痕横截面积,并减小切向磨削力与磨削比能;而随着磨削速度的增大,超声辅助磨削与普通磨削在单颗磨粒磨削划痕尺寸、磨削力之间的差异逐渐减弱。

关键词: 单颗磨粒, 超声辅助磨削, SiC陶瓷, 磨削划痕形貌, 材料去除机理

Abstract:  To study the effects of ultrasonic vibrations on the material removal mechanism during grinding of SiC ceramics under different grinding speeds, a brazed single abrasive grain tool was used to conduct comparison tests for UAG and conventional grinding(CG). In addition, the tests were conducted on the polished surfaces based on the continuous variable grinding depth methods. The results show that the materials for both UAG and CG of SiC both experience the following changing stages, i. e., plastic removal→brittle-plastic transition→large scale brittle fracture, with increasing grinding depths of the single abrasive grain. Compared to CG, UAG may effectively enlarge the critical depth of brittle-plastic transition for SiC ceramics when grinding speed is as 1 m/s, and may also produce lower tangential grinding forces and specific grinding energies. However, the differences between UAG and CG forthe critical depth of brittle-plastic transition and grinding forces will be gradually weakened with increasing grinding speed. 

Key words:  , single abrasive grain, ultrasonic assisted grinding(UAG), SiC ceramic, grinding scratch morphology, material removal mechanism

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